Si500D
Package Specifications
Table 1. Package Diagram Dimensions (mm)
Dimension
Min
0.80
Nom
0.85
0.03
0.64
Max
0.90
0.05
0.69
Dimension
Min
0.00
—
Nom
0.05
—
Max
0.10
0.10
0.10
0.08
A
A1
b
L1
0.00
aaa
bbb
ccc
0.59
—
—
D
3.20 BSC.
—
—
e
E
L
1.27 BSC.
4.00 BSC.
0.95
ddd
eee
—
—
—
—
0.10
0.05
1.00
1.05
Table 2. Pad Connections
Table 3. Tri-State/Powerdown/Driver Stopped
Function on OE (3rd Option Code)
1
2
OE
A
B
C
D
E
F
NC—Make no external
connection to this pin
Open Active Active Active Active Active
Active
3
4
5
6
GND
Output
1
Tri-
State
Power-
down
Driver
Stopped
Active
Active
Active
Level
0
Tri-
State
Power-
down
Driver
Stopped
Complementary Output
VDD
Active
Active
Active
Level
0 C CC CC
T T T T T T
Y YWW
Dimension
(mm)
C1
E
X1
Y1
2.70
1.27
0.75
1.55
0 = Si500
CCCCC = mark code
TTTTTT = assembly manufacturing code
YY = year
WW = work week
Figure 2. Top Mark
Figure 1. Recommended Land Pattern
Rev. 1.0
3
SILICON [ SILICON ]
