SE2521A60
RangeCharger™ 2.4 GHz Wireless LAN Front End
Package Information
Figure 17 shows the detailed device package diagram. The pads on the SiGe RF modules are plated with gold over
nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto FR4 based material using
eutectic Pb based or common tin based Pb free solder pastes.
4
5
GND
GND
GND
GND
GND
GND
13
3
2
1
4
1
2
3
5
6
7
8
24
23
22
24
23
22
21
20
19
18
6
7
GND
GND
GND
GND
GND
GND
GND
GND
GND
17
GND
GND
GND
GND
GND
GND
GND
8
GND
GND
GND
GND
9
9
21
20
10
10
11
12
GND
GND
GND
GND
GND
GND
GND
GND
11
12
19
18
GND
16
GND
15
GND
15
GND
16
17
14
13
14
TOP SIDE
NOTES :
GROUND PAD
DETAIL
SIGNAL PAD
DETAIL
BOTTOM SIDE
Figure 17: SE2521A60 Package Diagram
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2521A60 is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:
SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number 69-
APP-01.
SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number
69-APP-02.
177-DST-01 Rev 1.4 Apr-04-2006
Confidential
13 of 16
QA040406
SIGE [ SIGE SEMICONDUCTOR, INC. ]
