6.4 Soldering
Test
Passed through the re-flow oven under It shall fulfill the
the following condition and left at room specifications in Table
temperature
for
1
hour
before 1.
measurement.
Temperature at
surface of the
substrate
Time
Preheat 150 5
60 10 sec.
10 3 sec.
Peak 240 5
6.5 Solder
Ability
Dip the resonator terminals into the More than 95% of the
terminal surface shall
be covered.
solder bath at 230 5 for 3 0.5 sec.
6.6 High
It shall fulfill the
specifications in Table
1.
Subject the resonator to 80 5
4 hours. Then release the resonator
into the room conditions for 1 hour prior
to the measurement.
for 96
Temperature
Exposure
6.7 Low
It shall fulfill the
specifications in Table
1.
Subject the resonator to –20 5 for 96
4 hours. Then release the resonator
into the room conditions for 1 hour prior
to the measurement.
Temperature
6.8 Temperature
Cycling
It shall fulfill the
specifications in Table
1.
Subject the resonator to –20
minutes followed by a high temperature
of 85 for 30 min. Cycling shall be
for 30
repeated 5 times with a transfer time of
15 second at the room condition for 1
hour prior to the measurement.
TABLE1
Item
Specification
F/Fo 0.3% max
Ro 10 Ohm
Oscillation Frequency Change
Resonant Impedance
7.
SHOULDER [ SHOULDER ELECTRONICS LIMITED. ]
