SAW FILTER
HDQSF45A7Dc SIP5Dc
measurement shall be made within 1h.
appearance.
Thermal
shock
The specimen shall be subjected to 8 continuous
cycles each as shown below. Then it shall be
subjected to standard atmospheric conditions for
1h, after which measurement shall be made
within 1h.
Temperature
+25 ℃=>-40 ℃ 0.5h
-40 ℃ 4h
-40 ℃=>+85 ℃ 2h
+85 ℃ 4h
+85 ℃=>+25 ℃ 0.5h
+25 ℃ 1h
Duration
1
2
3
4
5
6
Resistance to Reflow soldering method
Soldering
heat
Peak: 255 ±5 ℃, 220±5 ℃, 40s
At electrode temperature of the specimen.
The specimen shall be passed through the reflow
furnace with the condition shown in the above
profile for 1 time.
The specimen shall be stored at standard
atmospheric conditions for 1h, after which the
measurement shall be made. Test board shall be
1.6 mm thick. Base material shall be glass fabric
base epoxy resin.
Solder ability Immerse the pins melt solder at 260℃+5/-0℃ More then 95% of
for 5 sec.
total area of the
pins should be
covered with solder
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