SAW FILTER
HDF1575A S-6
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a
high temperature of +85℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in 4.3.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in 4.3.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 4.3.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in 4.3.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 4.3.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component.
Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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