4. DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -45℃for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in table 1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1
sec. Then release the device into the room conditions for 4 hours. It shall meet the
specifications in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More
than 95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times.
the filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in
table 1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
Please avoid ultrasonic cleaning
component.
6.3 Soldering
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