SAW FILTER
HDBF14000D64 SF6-4
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2.2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2.2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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