6. Electrical Characteristics
6.1. Static Characteristics (T
a
= 25
unless otherwise specified)
25
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Symbol
I
GSS
I
DSS
V
(BR)DSS
V
th
R
DS(ON)
Test Condition
V
GS
=
±20
V, V
DS
= 0 V
V
DS
= 250 V, V
GS
= 0 V
I
D
= 10 mA, V
GS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
V
GS
= 10 V, I
D
= 3.8 A
Min
250
1.5
Typ.
0.41
Max
±1
10
3.5
0.5
Ω
V
Unit
µA
6.2. Dynamic Characteristics (T
a
= 25
unless otherwise specified)
25
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Gate resistance
Switching time (rise time)
Switching time (turn-on time)
Switching time (fall time)
Switching time (turn-off time)
Symbol
C
iss
C
rss
C
oss
r
g
t
r
t
on
t
f
t
off
V
DS
= OPEN, f = 1 MHz
See Figure 6.2.1.
Test Condition
V
DS
= 100 V, V
GS
= 0 V, f = 1 MHz
Min
Typ.
550
5.1
40
5.8
28
32
16
66
Max
Ω
ns
Unit
pF
Fig. 6.2.1 Switching Time Test Circuit
6.3. Gate Charge Characteristics (T
a
= 25
unless otherwise specified)
25
Characteristics
Total gate charge (gate-source plus
gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Q
g
Q
gs1
Q
gd
Test Condition
V
DD
≈
200 V, V
GS
= 10 V, I
D
= 7.5 A
Min
Typ.
16
3.3
5.3
Max
Unit
nC
25
6.4. Source-Drain Characteristics (T
a
= 25
unless otherwise specified)
Characteristics
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Peak reverse recovery current
Symbol
V
DSF
t
rr
Q
rr
I
rr
Test Condition
I
DR
= 7.5 A, V
GS
= 0 V
I
DR
= 7.5 A, V
GS
= 0 V
-dI
DR
/dt = 100 A/µs
Min
Typ.
150
0.8
11
Max
-1.7
Unit
V
ns
µC
A
3/8
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