PQ2Lxxx2MSPQ Series
Fig.3 Power Dissipation vs. Ambient
Temperature
1000
900
800
700
600
500
400
Mounting PCB
PCB
Copper foil
300
200
100
0
25
50
-40
0
75 85 100 125 150
-25
Material
PCB Size
Copper foil area
Thickness of copper
: Glass-cloth epoxy resin
: 20×20×1.0mm
: 180mm2
Ambient temperatureTa (°C)
Note) Oblique line portion:Overheat protection may operate in this area.
: 35μm
Fig.4 Overcurrent Protection Characteristics
Fig.5 Reference Voltage Deviation vs. Junction
(Typical Value)
Temperature (PQ2L3252MSPQ)(Typical Value)
100
20
15
10
5
75
50
0
VO2
-5
VO1
-10
25
0
-15
-20
0
0.1
0.2
0.3
0.4
-50 -25
0
25
50
75 100 125
O
Output current I (A)
Junction temperature Tj (°C)
Fig.6 Output Voltage(VO1) vs. Input Voltage
Fig.7 Output Voltage(VO2) vs. Input Voltage
(PQ2L3152MSPQ)(Typical Value)
(PQ2L3152MSPQ)(Typical Value)
4
2.0
3
2
1
1.5
1.0
0.5
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Input voltage VIN (V)
Input voltage VIN (V)
Sheet No.: OP06046
3
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
