PC8171xNSZ1B Series
Manufacturing Guidelines
●
Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or m ore, 60s or less
100
Preheat
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270℃ and within 10s.
Preheating is within the bounds of 100 to 150℃ and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400℃.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: OP18004EN
10
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
