GM5BW96320A
● Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 15.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
3. When using a second reflow, the second process should be carried out as soon as possible after the first.
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
5. The Reflow Profile shown in Fig. 15 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 15 Temperature Profile
260 (MAX)
1 ~ 2.5°C/s
1 ~ 4°C/s
220
200
60s (MAX)
150
25
60 ~ 120s
5s (MAX)
1 ~ 4°C/s
Time (s)
● Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 16 shows the recommended solder pattern for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
Fig. 16 Recommended Solder Pad Design
Product center
1.5
1.5
4.5
NOTE: Unit: mm
Sheet No.: DG-06Y004A
12
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
