Preliminary
■
Absolute Maximum Ratings
Parameter
Power dissipation (Package total)
Forward current *1
Peak pulsed forward current *1, *2
Forward current derating factor *1, 2
Reverse voltage *1
Operating temperature *3
Storage temperature *4
Soldering temperature *5
Symbol
P
I
F
I
FM
DC
Pulse
V
R
Tc
Tstg
Tsol
Rating
264
30
50
0.5
0.83
5
-30 to +100
-40 to +100
350
GM5BW94320A
(Tc = 25°C)
Unit
mW
mA
mA
mA/°C
mA/°C
V
°C
°C
°C
single
*
1 Rating for = 1/10,chip (die) operation.
2 Duty ratio
width =
*
3 Case temperaturePulse External0.1 ms
(See
Dimensions
*
4 Do not exceed these temperatures under anyon page 2)while in packing. Refer to
Storage and Handling.
condition
*
5 Each terminal must be soldered with a 30 W soldering iron within 3 seconds under 350°C.
*
For Reflow Soldering information, see Fig. 17.
values here follow the derating curves
*
6 Operating currentthe leads for heat sinking, therefore the shown in Fig. 1 throughrange3.is prescribed by Tc.
7 This device uses
operating temperature
*
■
Electro-optical Characteristics
Parameter
Forward voltage *1
Luminous intensity *1, *2
Chromaticity coordinates *1, *3
Reverse current *1
Symbol
V
F
I
V
x, y
I
R
V
R
= 4 V
I
F
= 25 mA
Conditions
MIN.
–
*3
*4
—
TYP.
3.4
3600
0.31, 0.31
—
MAX.
4.4
*3
*4
100
(Tc = 25°C)
Unit
V
mcd
µA
(die)
*
1 Rating for single chipModeloperation.
2 Measured by EG&G
550
±15%)
*
3 Measured by Otsuka Electronics(Radiometer/Photometer) after 20 ms drive (Tolerance: ±0.02). All chips (die) operating.
Model MCPD-2000 after 20 ms drive (Tolerance: x, y:
*
4 See Luminosity Rank table on page 6.
*
5 See Chromaticity Rank table on page 6.
*
Sheet No.: DG-067010A
3
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
