Model No. GM2BB**GT4E
“Contents in this technical document be changed without any notice due to the product modification.”
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7-2 Soldering
This product is reflow ready model (within 2 times), but it is not ready for solder dipping.
ꢀ
Reflow
① Package temperature at reflow soldering is defined in the Fig. below. However, even
when it is under the profile condition, external stress can damage the internal packages.
Please test your reflow method and verify the solderability before use.
② Giving the soldering process promptly after opened aluminum package is recommended.
Soldering process must be completed including 2ndreflow as repairing within 7 days
(Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened.
(Storage in a dry box after the first reflow is recommended.)
③ Recommended solder paste
Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD)
④ Recommended Temperature Profile
260( MAX)
1 to 2.5℃/s
1 to 4℃/s
220
200
150
60s (MAX)
60 to 120s
5s (MAX)
1 to 4℃/s
25
Time [second]
In order to secure the product reliability, it is recommended to control the peak temperature
and temperature gradient. Moreover, since the thermal conduction to the products depends
on the specification of the reflow machine, and the size and layout of the PCBs please test
your solder conditions carefully.
Moreover, after the reflow process, if the activator remains in the flux between anode and
cathode, the remaining activator might react during high temperature operation, and the
electro-migration is generated and there will be a possibility of a short-circuit. Please use
it after confirming the electro-migration is not generated while mounted actual.
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sharp LD-E7-7-14-A
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