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GM2BB50GT4E 参数 Datasheet PDF下载

GM2BB50GT4E图片预览
型号: GM2BB50GT4E
PDF下载: 下载PDF文件 查看货源
内容描述: [Single Color LED,]
分类和应用: 光电
文件页数/大小: 23 页 / 2494 K
品牌: SHARP [ SHARP ELECTRIONIC COMPONENTS ]
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Model No. GM2BB**GT4E  
“Contents in this technical document be changed without any notice due to the product modification.”  
http://www.sharp-world.com/products/device/  
7-2 Soldering  
This product is reflow ready model (within 2 times), but it is not ready for solder dipping.  
Reflow  
① Package temperature at reflow soldering is defined in the Fig. below. However, even  
when it is under the profile condition, external stress can damage the internal packages.  
Please test your reflow method and verify the solderability before use.  
② Giving the soldering process promptly after opened aluminum package is recommended.  
Soldering process must be completed including 2ndreflow as repairing within 7 days  
(Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened.  
(Storage in a dry box after the first reflow is recommended.)  
③ Recommended solder paste  
Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD)  
④ Recommended Temperature Profile  
260( MAX)  
1 to 2.5/s  
1 to 4/s  
220  
200  
150  
60s (MAX)  
60 to 120s  
5s (MAX)  
1 to 4/s  
25  
Time [second]  
In order to secure the product reliability, it is recommended to control the peak temperature  
and temperature gradient. Moreover, since the thermal conduction to the products depends  
on the specification of the reflow machine, and the size and layout of the PCBs please test  
your solder conditions carefully.  
Moreover, after the reflow process, if the activator remains in the flux between anode and  
cathode, the remaining activator might react during high temperature operation, and the  
electro-migration is generated and there will be a possibility of a short-circuit. Please use  
it after confirming the electro-migration is not generated while mounted actual.  
19  
sharp LD-E7-7-14-A  
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