Model No. GM2BB**QB2C
“Contents in this technical document be changed without any notice due to the product modification.”
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⑤ Recommended solder pad design
ꢀ
We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability
depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test
and verify the solderability under the actual solder method.
Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the
remaining activator in the flux. Please make a suitable selection and test of the metal mask
in terms of pitch size and thickness before mass production.
2.8
1.15
0.25
（Unit：mm）
0.5
⑥ Precautions for PCB backside dip process
ꢀ
Please verify your conditions carefully in giving the dip process on the backside of the
PCBs, since the warped boards caused by heat and heat itself affect the inside of the
package. It is recommended to give the reflow process after dip process.
Though it is also available to give the reflow process before the dip process, the interval
of the two processes should be as short as possible.
7-3 Cleaning
・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning.
Please use the soldering paste without need of cleaning.
・ Avoid ultrasonic cleaning.
20
sharp LD-E7-3-14-A
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
