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GL100MN1MP1 参数 Datasheet PDF下载

GL100MN1MP1图片预览
型号: GL100MN1MP1
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装型,高功率 [Surface Mount Type, High Power]
分类和应用: 红外LED光电
文件页数/大小: 11 页 / 911 K
品牌: SHARP [ SHARP ELECTRIONIC COMPONENTS ]
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GL100MN1MPx
Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% deg-
radation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 10. Sharp rec-
ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters
can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or
other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures
260° for
3 seconds. Do not dip-solder or
VPS-solder
this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
1 ~ 4°C/s
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
25°C
10s MAX.
60s MAX.
120s MAX.
90s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A00701EN
6