GL100MN1MPx
■
Absolute Maximum Ratings
Parameter
Forward current
Peak pulsed forward current *1
Reverse voltage
Power dissipation
Operating temperature
Storage temperature
Soldering temperature *2
100 µs, Duty ratio: 0.01
*
1 Pulse width: see reflow profile on page 6.
2 10 s (MAX.)
*
(Ta = 25°C)
Symbol
I
F
I
FM
V
R
P
Topr
Tstg
Tsol
Rating
50
0.5
6
75
-30 to +85
-40 to +95
240
Unit
mA
A
V
mW
°C
°C
°C
■
Electro-optical Charactertistics
Parameter
Forward voltage
Peak forward voltage
Reverse current
Radiant flux
Peak emission wavelength
Half intensity wavelength
Terminal capacitance
Response frequency
Half intensity angle
Symbol
V
F
V
FM
I
R
φ
e
λp
Δλ
C
t
f
C
Δθ
Conditions
I
F
= 20 mA
I
FM
= 0.5 A
V
R
= 3
V
I
F
= 20 mA
I
F
= 5 mA
I
F
= 5 mA
V
R
= 0, f = 1 MHz
–
–
MIN.
–
–
–
2.0
–
–
–
–
–
TYP.
1.2
3.0
–
–
940
45
50
300
±10
MAX.
1.5
4.0
10
6.0
–
–
–
–
–
(Ta = 25°C)
Unit
V
V
µA
mW
nm
nm
pF
kHz
degrees
Fig. 1 Forward Current vs.
Ambient Temperature
60
50
Forward current I
F
(mA)
40
30
20
10
Fig. 2 Peak Forward Current vs. Duty Ratio
10000
Peak forward current I
FM
(mA)
Pulse
width
≤
100
µs
Ta = 25°C
1000
100
10
10
-4
10
-3
10
-2
Duty ratio
10
-1
10
0
0
-50
-30
-25
85
0
25
50
75
100
Ambient temperature T
a
(°C)
Sheet No.: D1-A00701EN
3
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
