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SGM6019 参数 Datasheet PDF下载

SGM6019图片预览
型号: SGM6019
PDF下载: 下载PDF文件 查看货源
内容描述: [1.2A, 1.6MHz, High Efficiency Synchronous Step-Down Converter]
分类和应用:
文件页数/大小: 12 页 / 694 K
品牌: SGMICRO [ Shengbang Microelectronics Co, Ltd ]
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1.2A, 1.6MHz, High Efficiency  
SGM6019  
Synchronous Step-Down Converter  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
6019  
XXXX  
SGM6019  
TDFN-2×3-8L  
SGM6019YTDC8G/TR  
Tape and Reel, 3000  
-40to +85℃  
MARKING INFORMATION  
NOTE: XXXX= Date Code, Trace Code and Vendor Code.  
X X X X  
Vendor Code  
Trace Code  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
VIN.........................................................................-0.3V to 6V  
FB, SW, EN, MODE, PG....................-0.3V to VIN + 0.3V  
Operating Temperature Range.........................-40to +85℃  
Junction Temperature.....................................................150℃  
Storage Temperature Range..........................-65to +150℃  
Package Thermal Resistance  
TDFN-2×3-8L, θJA...................................................... 75/W  
Lead Temperature (Soldering, 10s) ...............................260℃  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
ESD Susceptibility  
HBM.............................................................................. 3000V  
MM.................................................................................. 200V  
RECOMMENDED OPERATING CONDITIONS  
Operating Temperature Range.......................-40to +85℃  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
SG Micro Corp  
www.sg-micro.com  
SEPTEMBER 2013  
2
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