PARAMETER DEFINITIONS
PARAMETER DESCRIPTION
R
ON
Resistance between source and drain with switch in the ON state
Output leakage current measured at S1, S2, and D with the switch OFF
Digital voltage at the IN pin that selects between S1 and S2 analog inputs
Voltage applied to the D or S1, S2 pins when D or S1, S2 is the switch input
A voltage that ENABLES the chip
I
O
V
IN
VI
V
C
C
C
V
V
EN
IN
Capacitance at the digital inputs
OFF
ON
IH
Capacitance at analog I/O (S1, S2, D) with switch OFF
Capacitance at analog I/O (S1, S2, D) with switch ON
Minimum input voltage for logic HIGH
IL
Minimum input voltage for logic LOW
I
I
IH (IIL)
Input current of the digital input
OS
Minimum short circuit current for S1, S2 and D
Propagation delay measured between 50% of the digital input to 90% of the analog output
when switch is turned ON. The peak analog voltage is 0.714V
TON
Propagation delay measured between 50% of the digital input to 90% of the analog output
when switch is turned OFF. The peak analog voltage is 0.714V
TOFF
BW
response of the switch in the ON state measured at 3dB down
Is an unwanted signal coupled from channel to channel. Measured in –dB. XTALK = 20 LOG
VOUT/VIN. This is non-adjacent crosstalk
XTALK
Magnitude variation between analog input and output pins when the switch is ON and the dc
offset of composite-video signal varies at the analog input pin. In the NTSC standard, the
frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V.
Phase variation between analog input and output pins when the switch is ON and the dc offset
of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency
of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V.
D
G
DP
Off isolation is the resistance (measured in –dB) between the input and output with the switch
off (NO)
OIRR
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. Shengbang Micro-electronics
recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
４
SGM330A
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
