11. Soldering profile
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
Pre-heat
120~150℃
240 C Max.
10 sec. Max.
Pre-heat time
Peak-Temperature
120 sec. Max.
Pre-heating
120~150 C
o
60sec. Max.
Above 200 C
2.5~5 C / sec.
o
240℃ Max.
Soldering time
Condition
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
o
1~5 C / sec.
Pre-heat
150~200℃
260 C Max.
10 sec. Max.
Pre-heat time
Peak-Temperature
120 sec. Max.
Pre-heating
150~200 C
o
60sec. Max.
Above 220 C
o
1~5 C / sec.
o
260℃ Max.
Soldering time
Condition
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process,
we don’t guarantee the products.
Rev. 02
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC-QP-7-07-25 (Rev.0.0)
SEOUL [ Seoul Semiconductor ]
