11. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
Pre-heat
120~150℃
120 sec. Max.
240℃ Max.
10 sec. Max.
10 sec. Max.
Pre-heat time
Pre-heating
o
60sec. Max.
Peak-Temperature
Soldering time Condition
120~150 C
2.5~5 C / sec.
o
Above 200 C
120sec. Max.
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder
o
o
1~5 C / sec.
260 C Max.
Pre-heat
150~200℃
120 sec. Max.
260℃ Max.
10 sec. Max.
Pre-heating
o
Pre-heat time
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time Condition
10 sec. Max.
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter,
the picking up nozzle that does not affect the silicone resign should be used.
[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 03
June 2009
www.acriche.com
SSC-QP-7-07-24 (Rev.00)
SEOUL [ Seoul Semiconductor ]
