Solder profile
1. Reflow solder conditions / profile
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Cooling
-5 °C/sec
Rising
5 °C/sec
Pre-heating
180
150
0
Time
[Hr]
2. Hand Solder conditions
2-1 Lead : Not more than 3 seconds @MAX280℃
2-2 Slug : Use a thermal-adhesives
* Caution
[1] Reflow soldering should not be done more than one time.
[2] Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
[3] Die slug is to be soldered.
[4] When soldering, do not put stress on the LEDs during heating.
[5] After soldering, do not warp the circuit board.
[6] Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 03
May 2008
17
www.ZLED.com
SEOUL [ Seoul Semiconductor ]
