uClamp3311T
REQPHIHGFED
Symbol
P
p k
I
p p
V
ESD
T
J
T
STG
o
Peak Pulse Power (tp = 8/20µs)
Maximum Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Air)
1
ESD per IEC 61000-4-2 (Contact)
1
Operating Temperature
Storage Temperature
Reverse Stand-Off Voltage
Punch-Through Voltage
Snap-Back Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
ESD Clamping Voltage
2
ESD Clamping Voltage
2
Dynamic Resistance
2, 3
Junction Capacitance
Notes
1)ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: t
p
= 100ns, t
r
= 0.2ns, I
TLP
and V
TLP
averaging window: t
1
= 70ns to
t
2
= 90ns.
3) Dynamic resistance calculated from I
pp
= 4A to I
pp
= 16A
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2015 Semtech Corporation
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R ating
Value
40
5
+/- 30
+/- 30
-40 to +85
-55 to +150
Units
Watts
A mp s
kV
°C
°C
C)
Parameter
Symbol
V
RWM
V
PT
V
SB
I
R
V
C
V
C
V
C
V
C
R
DYN
C
j
Conditions
Minimum
Typical
Maximum
3.3
Units
V
V
V
I
PT
= 2µA
I
SB
= 50mA
V
RWM
= 3.3V
I
PP
= 1A, tp = 8/20µs
I
PP
= 5A, tp = 8/20µs
I
PP
= 4A,
tlp = 0.2/100ns
I
PP
= 16A,
tlp = 0.2/100ns
tlp = 0.2 / 100ns
I/O pin to Gnd
V
R
= 0V, f = 1MHz
3.5
2.8
3.9
4.3
0.01
0.05
6.5
8
µA
V
V
V
5.6
8.6
V
0.25
5
7
Ohms
pF
2
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