SAMWIN
SW630
N-channel MOSFET
Features
■
High ruggedness
■
R
DS(ON)
(Max 0.4
Ω)@V
GS
=10V
■
Gate Charge (Typ 20nC)
■
Improved dv/dt Capability
■
100% Avalanche Tested
TO-220F
TO-220
TO-252
BV
DSS
: 200V
I
D
: 10A
1
1
2
1
3
2
3
2
3
R
DS(ON)
: 0.4ohm
2
1. Gate 2. Drain 3. Source
General Description
This power MOSFET is produced with advanced VDMOS technology of SAMWIN.
This technology enable power MOSFET to have better characteristics,
such as fast switching time, low on resistance, low gate charge and especially
excellent avalanche characteristics. This power MOSFET is usually used
at high efficient DC to DC converter block and SMPS.
It’s typical application is TV and monitor.
1
3
Order Codes
Item
1
2
3
Sales Type
SW P 630
SW F 630
SW D 630
Marking
SW630
SW630
SW630
Package
TO-220
TO-220F
TO-252
Packaging
TUBE
TUBE
REEL
Absolute maximum ratings
Symbol
V
DSS
I
D
I
DM
V
GS
E
AS
E
AR
dv/dt
P
D
T
STG
, T
J
T
L
Drain to Source Voltage
Continuous Drain Current (@T
C
=25
o
C)
Continuous Drain Current (@T
C
=100
o
C)
Drain current pulsed
Gate to Source Voltage
Single pulsed Avalanche Energy
Repetitive Avalanche Energy
Peak diode Recovery dv/dt
Total power dissipation (@T
C
=25
o
C)
Derating Factor above 25
o
C
Operating Junction Temperature & Storage Temperature
Maximum Lead Temperature for soldering
purpose, 1/8 from Case for 5 seconds.
(note 2)
(note 1)
(note 3)
88
0.7
-55 ~ + 150
300
(note 1)
10
5.5
40
±
30
324
8.8
5
38*
0.3
Parameter
Value
TO-220
200
10.0*
5.5*
TO-220F
Unit
V
A
A
A
V
mJ
mJ
V/ns
W
W/
o
C
o
C
o
C
*. Drain current is limited by junction temperature.
Thermal characteristics
Symbol
R
thjc
R
thcs
R
thja
Jun. 2011. Rev. 3.0
Parameter
Thermal resistance, Junction to case
Thermal resistance, Case to Sink
Thermal resistance, Junction to ambient
Value
TO-220
1.42
0.5
62.5
TO-220F
3.33
Unit
o
C/W
o
C/W
o
C/W
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