Board 1 SKYPER
®
32PRO R - Technical Explanations
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are
provided for information purposes only. These values can and do vary in different applications. All operating parameters should be
validated by user’s technical experts for each application.
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at
http://www.semikron.com.
For design support please read the SEMIKRON Application
Manual Power Modules available at
http://www.semikron.com.
General Description
The Board 1 SKYPER 32PRO is an adaptor board for the IGBT module e.g. SEMITRANS™, SEMiX (solder pin version).
The board can be customized allowing adaptation and optimization to the used IGBT module.
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed
by variation of R
Gon
and R
Goff
. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP, soft
®
turn-off behaviour as well as an over temperature trip level by using the temperature sensor integrated in SEMiX modules
®
(see Technical Explanations SKYPER 32PRO).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER
®
32PRO. Please read the Technical Explanations
SKYPER
®
32PRO before using the Adaptor Board.
®
®
Board 1 SKYPER
®
32PRO
3
Rev. 02 – 21.04.2010
© by SEMIKRON
SEMIKRON [ SEMIKRON INTERNATIONAL ]
