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1N5809D3A 参数 Datasheet PDF下载

1N5809D3A图片预览
型号: 1N5809D3A
PDF下载: 下载PDF文件 查看货源
内容描述: 超快速恢复电力整流器 [ULTRA FAST RECOVERY POWER RECTIFIER]
分类和应用: 二极管超快速恢复能力电源超快恢复二极管快速恢复二极管
文件页数/大小: 4 页 / 732 K
品牌: SEME-LAB [ SEME LAB ]
 浏览型号1N5809D3A的Datasheet PDF文件第2页浏览型号1N5809D3A的Datasheet PDF文件第3页浏览型号1N5809D3A的Datasheet PDF文件第4页  
ULTRA FAST RECOVERY  
POWER RECTIFIER  
1N5809D3A / 1N5809D3B  
DLCC3 - Light Weight Hermetic Ceramic Surface Mount  
Package is designed as a drop In replacement for “D-5B” / “E-  
MELF” package†  
Ultra Fast Reverse Recovery  
Switching Power Supply Applications  
Space Level and High-Reliability Screening Options Available  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
A
V
V
I
Breakdown Voltage  
110V  
BR  
Working Peak Reverse Voltage  
Maximum Rectified Current I 1 = T +55°C  
100V  
RWM  
(1)  
A
Derate above T 55°C  
3.0A  
O
o
25mA/°C  
125A  
A
(2)  
I
Surge Current, t = 8.3ms  
p
FSM  
T
Junction Temperature Range  
Storage Temperature Range  
-65 to +175°C  
-65 to +175°C  
J
T
stg  
THERMAL PROPERTIES  
Symbols  
Parameters  
Max.  
Units  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction To Solder Pads T = 25°C  
SP  
R
17  
50  
θJSP(IN)  
(3)  
(4)  
R
Thermal Resistance, Junction To Ambient, On PCB  
Thermal Resistance, Junction To Ambient, On PCB  
θJA(PCB)  
R
117  
θJA(PCB)  
Notes  
(1) I  
is rated at 3.0A @ T = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where  
O1  
A
T
does not exceed 175°C; This equates to R  
θJA(PCB)  
52°C/W.  
J(Max)  
(2) T = 25°C @ I =3.0A and V for ten 8.3mS surges at 1 minute intervals.  
RWM  
A
O
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.  
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.  
is rated at 1.5A @ T = 55°C for PC boards where R 120°C/W. Derate at 12.5mA/°C above T = 55°C in this case.  
θJA(PCB) A  
I
O1  
A
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.  
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.  
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However  
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to  
verify that datasheets are current before placing an order.  
Semelab plc  
Telephone +44 (0) 1455 556565  
Email: sales@semelab-tt.com  
Coventry Road, Lutterworth, Leicestershire, LE17 4JB  
Fax +44 (0) 1455 552612  
Website: http://www.semelab-tt.com  
Document Number 9036  
Issue 2  
Page 1 of 4