5036 series
MEASUREMENT CIRCUITS
I
Note: Bypass capacitors specified in each measurement circuit below should be connected between VCC
and GND, and VCC2 and GND. Load resistance specified in each measurement circuit below should
be connected to OUT and OUTN pins (excluding measurement circuit 3).
Circuit wiring of bypass capacitors and load resistance should be connected as short as possible. If the
circuit wiring is long, the required characteristics may not be realized. Also, if the values of bypass
capacitors and load resistance differ from the description in this document or are not connected, the
required characteristics may not be realized.
Measurement Circuit 1
0.01µF
(Ceramic chip capacitor)
Measurement Circuit 3
0.01µF
(Ceramic chip capacitor)
10µF
I
CC,
I
STB
A
10µF
VCC
VCC2
OUT
R1
2V
Test point
V
T
I
PD
A
R
PD
=V
PD
/I
PD
V
PD
V
VCC
SW1
XIN
VCC2
OUT
I
Z
A
SW2
I
Z
Signal
Generator
R1
C1
XOUT
OE
I
IH,
I
IL
OUTN
GND
R1
Test point
OE
OUTN
GND
A
A
V
IH
,V
IL
C1: 0.01µF
R1: 49.9Ω
Measurement Circuit 4
0.01µF
(Ceramic chip capacitor)
Measurement Circuit 2
10µF
0.01µF
(Ceramic chip capacitor)
VCC
10µF
XIN
VCC2
OUT
R1
V
T
VCC
VCC2
OUT
R1
V
T
XIN
R1
OUTN
TEST GND
V
OH
,V
OL
2V
XOUT
OUTN
GND
Duty2,V
Opp
,t
r
,t
f
(Single ended)
R1
Duty1 (Differential)
2V
R1: 49.9Ω
R1: 49.9Ω
XIN = HIGH: OUT = HIGH, OUTN = LOW
XIN = LOW : OUT = LOW, OUTN = HIGH
SEIKO NPC CORPORATION —9
SEIKO [ SEIKO EPSON CORPORATION ]
