5027 series
SERIES CONFIGURATION
For Fundamental Oscillator
Operating
Output drive
supply
capability
voltage range
[mA]
[V]
PAD layout
Recommended
oscillation
frequency range
*1
[MHz]
20 to 60
60 to 100
20 to 60
60 to 100
20 to 60
60 to 100
Version
*2
f
O
output
5027A1
5027AP
5027B1
5027BP
5027C1
5027CP
f
O
/2
output
5027A2
5027AQ
5027B2
5027BQ
5027C2
5027CQ
f
O
/4
output
5027A3
5027AR
5027B3
5027BR
5027C3
5027CR
f
O
/8
output
5027A4
5027AS
5027B4
5027BS
5027C4
5027CS
f
O
/16
output
5027A5
5027AT
5027B5
5027BT
5027C5
5027CT
f
O
/32
output
5027A6
5027AV
5027B6
5027BV
5027C6
5027CV
f
O
/64
output
5027A7
5027AW
5027B7
5027BW
5027C7
5027CW
Flip Chip
Bonding
1.60 to 3.63
±
4
Wire Bonding
Type I
Wire Bonding
Type II
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027
××
and chip form devices have designation CF5027
××
.
For 3rd Overtone Oscillator
Operating
Output drive
supply
capability
voltage range
[mA]
[V]
Recommended oscillation frequency range
*1
[MHz] and version
*2
PAD layout
40 to 50
Flip Chip Bonding
1.60 to 3.63
±
8
Wire Bonding Type I
Wire Bonding Type II
5027MA
5027NA
5027PA
50 to 65
5027MB
5027NB
5027PB
65 to 85
5027MC
5027NC
5027PC
85 to 110
5027MD
5027ND
5027PD
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027×× and chip form devices have designation CF5027××.
VERSION NAME
Device
WF5027××–4
Package
Wafer form
Version name
WF5027
Form WF: Wafer form
CF: Chip (Die) form
−4
Oscillation frequency range, frequency divider function
Pad layout type A, M: for Flip Chip Bonding
B, N: for Wire Bonding (type I)
C, P: for Wire Bonding (type II)
CF5027××–4
Chip form
SEIKO NPC CORPORATION —2
SEIKO [ SEIKO EPSON CORPORATION ]
