Absolute Maximum Rating
(1)
Parameter
Input Voltage
Output Voltage
Output Sink Current
Thermal Resistance, Junction-to-Ambient SOT89)
(
Lead Temperature (Soldering, 5 sec.)
Junction Temperature
Storage Temperature
T
J
T
S
Symbol
V
DD
V
OUT
I
OUT
Θ
JA
Value
-0.3�½�7V
-0.3 to 4.6
400
180
260
0 to +150
-40 to +150
Units
V
V
mA
°C/W
°C
°C
°C
Electrical Characteristics
V
DD
= 3.7V; No Load; T
J
= 25°C; unless otherwise noted
Symbol
Output Sink Current
Load Regulation
Line Regulation
Output Dropout Voltage
(2)
Parameter
I
SINK
Conditions
V
OUT
=0.2V
V
OUT
=0.2V to 3V
V
DD
=3V to 6V
,V
OUT
=0.2V
Min
315
Typ
350
22
1.88
150
212
Max
390
Unit
mA
mA/V
mA/V
mV
μA
V
OUTL
I
DD
Supply Current Consumption
Note 1:
Exceeding the absolute maximum rating may damage the device.
Note 2:
Output dropout voltage: 90% x I
OUT
@
V
OUT
=200mV
Thermal Considerations
It is important that the thermal limit of the package is not exceeded.
The power dissipation for a given application can be calculated as following:
The power dissipation (P
D
) is
P
D
= I
OUT
* [V
IN
– V
OUT
]
The thermal limit of the package is then limited to P
D(MAX)
= [T
J
– T
A
]/Θ
JA
where T
J
is the junction temperature,
TA is the ambient temperature, and
Θ
JA
is around 180°C/W for SE9135. SE9135 is designed to enter thermal
protection at 150°C. For example, if T
A
is 25°C then the maximum P
D
is limited to about 0.7W. In other
words, if I
OUT(MAX)
= 350mA, then [V
IN
– V
OUT
] cannot exceed 2V.
The SE9135 has built-in thermal
protection. When the thermal limit is exceeded, the IC will enter protection, and V
OUT
will be pulled to ground.
Revision 7/27/2007
Preliminary and all contents are subject to change without prior notice
© Seaward Electronics, Inc., 2006. •
www.seawardinc.com.cn
• Page 2