■SI-3000KM Series
■Reference Data
Copper Foil Area-Thermal Resistance
Glass-epoxy substrate : 30×30mm
100
90
80
70
60
50
40
θ
10
100
1000
Copper Foil Area (mm2)
Copper Foil Area-Power Dissipation
Glass-epoxy substrate : 30×30mm
1.5
1
Ta=25°C
40°C
60°C
85°C
0.5
0
10
100
1000
Copper Foil Area (mm2)
• Obtaining Junction Temperature
Case temperature
measurement point
Temperature of lead part of GND terminal: Measure TC
with thermocouple. Substitute value to the following for-
mula to obtain the junction temperature
Tj=PD × θj–C + TC
( θj–C = 6°C/W)
■Example of Soldering Pattern Design
(Unit : mm)
6.0
6.1
2.4
2.5
5.88
1.27
0.8
0.47
7