Audio Amplification Transistor
2SA2223
Package Outline Drawing, TO-3P
15.8 ±0.2
15.6 ±0.3
14.0 ±0.3
5.0 MAX
2.1 MAX
Exposed
heatsink pad
13.6 ±0.2
9.6 ±0.2
Branding
Area
XXXXXXXX
XXXXX
XXXXX
+0.2
–0.1
1.7
+0.2
–0.1
+0.2
–0.1
+0.2
–0.1
0.6
2
2
+0.2
–0.1
3
+0.2
–0.1
1.0
View A
View B
5.45 ±0.1
Terminal dimension at lead tip
1
2
3
0.7 MAX
0.7 MAX
View A
View B
Gate burr: 0.3 mm (max.), mold flash may appear at opposite side
Terminal core material: Cu
Branding codes (exact appearance at manufacturer discretion):
1st line, type: A2223
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 100
2nd line left, lot:
YM
Where: Y is the last digit of the year of manufacture
Package: TO-3P (M100)
M is the month (1 to 9, O, N, D)
Approximate weight: 6 g
2nd line right, subtype:
H
Where: H is the hFE rating (O, R, or Y; for values see
footnote, Electrical Characteristics table)
Dimensions in millimeters
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
38104
4
SANKEN ELECTRIC CO., LTD.
SANKEN [ SANKEN ELECTRIC ]
