K4M561633G - R(B)N/G/L/F
Package Dimension and Pin Configuration
< Bottom View
*1
>
E
1
Mobile SDRAM
< Top View
*2
>
54Ball(6x9) FBGA
9
A
B
C
D
1
D
E
F
G
H
J
D
e
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
1
VSS
DQ14
DQ12
DQ10
DQ8
UDQM
A12
A8
VSS
2
DQ15
DQ13
DQ11
DQ9
NC
CLK
A11
A7
A5
3
VSSQ
VDDQ
VSSQ
VDDQ
VSS
CKE
A9
A6
A4
7
VDDQ
VSSQ
VDDQ
VSSQ
VDD
CAS
BA0
A0
A3
8
DQ0
DQ2
DQ4
DQ6
LDQM
RAS
BA1
A1
A2
9
VDD
DQ1
DQ3
DQ5
DQ7
WE
CS
A10
VDD
E
Pin Name
CLK
CS
CKE
A
A1
b
A
0
~ A
12
BA
0
~ BA
1
RAS
CAS
WE
L(U)DQM
Pin Function
System Clock
Chip Select
Clock Enable
Address
Bank Select Address
Row Address Strobe
Column Address Strobe
Write Enable
Data Input/Output Mask
Data Input/Output
Power Supply/Ground
Data Output Power/Ground
[Unit:mm]
z
< Top View
*2
>
DQ
0
~
15
V
DD
/V
SS
V
DDQ
/V
SSQ
#A1 Ball Origin Indicator
SEC Week XXXX
K4M561633G
Symbol
A
A
1
E
E
1
D
D
1
e
b
z
Min
-
0.25
7.9
-
10.9
-
-
0.45
-
Typ
-
-
8.0
6.40
11.0
6.40
0.80
0.50
-
Max
1.00
-
8.1
-
11.1
-
-
0.55
0.10
January 2006
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
