May. 2010
Product Guide
DDR3 SDRAM Memory
6. Package Dimension
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A)
(Datum B)
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
1.10 ± 0.10
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
96Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
1.10 ± 0.10
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
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SAMSUNG [ SAMSUNG ]
