SAMHOP Microelectronics Corp.
3W STEREO AUDIO POWER AMPLIFIER WITH UP / DOWN GAIN CONTROL
PACKAGE OUTLINE
SM7513F 16PIN SSOP
9
Unit : mm
Thermal Pad
D1
16
9
16
8
1
Thermal Pad
1
8
e
b
S
D
GAUGE PLANE
SEATING PLANE
θ= 0~8
L
0.05
L1
SYMBOLS
MIN.
―
NOM.
―
―
1.00
―
5.00
4.40
6.40 BSC
0.65 BSC
1.00 REF
0.60
MAX.
1.20
0.15
1.05
0.30
5.10
4.50
NOTES:
1. JEDEC OUTLINE:
A
A1
A2
b
D
E1
E
e
L1
L
s
θ
0.00
0.80
0.19
4.90
4.30
MO-153 AB/MO-153 ABT(THERMALLY VARIATIONS ONLY)
2. DIMENSIONS “ D"DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.MOLD FLASH
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
0.15mm PER SIDE.
3. DIMENSION “E"DOES NOT INCLUDE INTER-LEAD
FLASH, OR PROTRUSIONS. INTER-LEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE.
0.45
0.20
0°
0.75
―
8°
―
―
THERMALLY ENHANCED DIMENSIONS
PAD DICE
E1
D1
MIN. MAX.
MIN.
1.98
MAX.
3.00
118 x 11E
1.98
3.00
Page 11
V.1.0 Apr 30,2007