SAMHOP Microelectronics Corp.
3W STEREO AUDIO POWER AMPLIFIER WITH ADVANCED DC VOLUME CONTROL
PACKAGE OUTLINE
SM7512F 16PIN SSOP
Unit : mm
Thermal Pad
D
(NOTE 5)
C
16
9
Gauge plane
0.2000
1
8
e
b
7°(4X)
y
SYMBOLS
MIN.
1.35
0.00
―
0.20
0.19
4.80
5.80
3.80
―
NOM.
1.50
―
1.45
0.25
―
MAX.
A
A1
A2
b
C
D
E
E1
e
L
y
1.65
0.10
―
NOTES:
1. PACKAGE BODY SIZE EXCLUDE MOLD FLASH PROTRUSION
OR GATE BURRS.
0.30
0.25
5.00
6.20
4.00
―
1.27
0.10
8°
2. TOLERANCE ± 0.1mm UNLESS OTHERWISE SPECIFIED
3. DIMENSION L IS MEASURED IN GAGE PLANE
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
―
6.0
3.9
0.64
―
―
―
INCH DIMENSION ARE NOT NECESSARILY EXACT.
5. DIE PAD EXPOSURE SIZE IS ACCORDING TO LEAD FRAME
DESIGN
0.40
―
0°
6. FOLLOWED FROM JEDEC MO-137
θ
L1
0.95
1.05
1.15
Page 14
V.1.4 Revised May 28,2007