SAMHOP Microelectronics Corp.
3W STEREO AUDIO POWER AMPLIFIER WITH ADVANCED DC VOLUME CONTROL
PACKAGE OUTLINE
Unit : mm
SM7511 24 PIN TSSOP ( 150mil )
Thermal Pad
(NOTE 5)
D
C
24
13
Gauge plane
0.2000
1
12
e
b
12°(4X)
y
SYMBOLS
MIN.
―
NOM.
―
―
1.00
―
―
7.80
6.40
4.40
0.65
0.60
―
MAX.
1.15
0.10
1.05
0.30
0.20
7.90
6.60
4.50
―
A
A1
A2
b
C
D
E
E1
e
L
y
NOTES:
0.00
0.80
0.19
0.09
7.70
6.20
4.30
―
1. PACKAGE BODY SIZE EXCLUDE MOLD FLASH PROTRUSION
OR GATE BURRS.
2. TOLERANCE ± 0.1mm UNLESS OTHERWISE SPECIFIED
3. COPLANARITY：0.1mm
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSION ARE NOT NECESSARILY EXACT.
5. DIE PAD EXPOSURE SIZE IS ACCORDING TO LEAD FRAME
DESIGN
0.45
―
0°
0.75
0.10
8°
6. FOLLOWED FROM JEDEC MO-153
θ
―
L1
0.90
1.00
1.10
V.1.3 Revised April 02,2007
Page 21
SAMHOP [ SAMHOP MICROELECTRONICS CORP. ]
