Transient Voltage Suppressors - 3KP Series
Soldering Parameters
Feflow Condition
Lead-free assembly
- Temperature Min (T
- Temperature Max (T
)
150°C
200°C
s(min)
Pre Heat
)
s(min)
- Time (min to max) (t )
60-180 secs
3°C/second max
3°C/second max
217°C
s
Average ramp up rate (Liquidus Temp (T ) to peak
L
T
to T - Ramp-up Rate
L
S(max)
- Temperature (T ) (Liquidus)
L
Reflow
- Time (min to max) (t )
60-150 seconds
s
+0/-5
°C
Peak Temperature (T
)
P
260
Time within 5°C of actual peak Temperature (t )
20-40 seconds
6°C/second max
8 minutes Max.
280°C
p
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
)
P
Physical Specifications
tp
TP
one
P
Weight
0.045oz., 1.2g
Ramp-up
Critical Z
to T
T
L
JEDEC DO-201 molded plastic body over
passivated junction.
TL
tL
Case
Ts(max)
Polarity
Termina
Color band denotes the cathode except Bipolar.
Ramp-down
Ts(min)
Matte Tin axial leads, solderable per
JESD22-B102D.
ts
Preheat
Time (t)
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Flow/Wave Soldering
Peak Temperature :
Dipping Time :
265°C
10 seconds
1 time
Soldering :
Thermal Shock
Specifications are subject to change without notice.
Circuit Protection
System
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Please refer to http://www.ruilon.com for current information.