Electrical Characteristics (TA=25°C Unless Otherwise Noted)
RU3010H
Symbol
Parameter
Test Condition
Unit
Min. Typ. Max.
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS Zero Gate Voltage Drain Current
VGS(th) Gate Threshold Voltage
V
VGS=0V, IDS=250mA
30
VDS= 30V, VGS=0V
1
mA
TJ=85°C
30
V
VDS=VGS, IDS=250mA
1
2
3
IGSS
Gate Leakage Current
VGS=±20V, VDS=0V
nA
±100
VGS= 10V, IDS=8A
VGS= 4.5V, IDS=6A
18
40
30
70
mW
mW
③
Drain-Source On-state Resistance
RDS(ON)
Diode Characteristics
③
Diode Forward Voltage
ISD=1A, VGS=0V
1
V
VSD
trr
Reverse Recovery Time
7
9
ns
ISD=8A, dlSD/dt=100A/ms
Qrr
Reverse Recovery Charge
nC
④
Dynamic Characteristics
RG
Ciss
Coss
Crss
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
W
1.2
590
120
60
4
Input Capacitance
VGS=0V,
VDS=15V,
Frequency=1.0MHz
pF
Output Capacitance
Reverse Transfer Capacitance
td(ON) Turn-on Delay Time
tr Turn-on Rise Time
td(OFF) Turn-off Delay Time
tf Turn-off Fall Time
VDD=15V, RL=2.1W,
IDS=8A, VGEN=10V,
RG=6W
10
18
8
ns
④
Gate Charge Characteristics
Qg
Qgs
Qgd
Total Gate Charge
9
2
3
12
VDS=24V, VGS=10V,
IDS=8A
nC
Gate-Source Charge
Gate-Drain Charge
Notes:
Pulse width limited by safe operating area.
②When mounted on 1 inch square copper board, t £10sec.
③Pulse test ; Pulse width£300ms, duty cycle£2%.
④Guaranteed by design, not subject to production testing.
2
CopyrightÓ Ruichips Semiconductor Co., Ltd
Rev. A– JUN., 2011
www.ruichips.com