FEATURES
1
/
3
APPLICATIONS
Wireless Network
Telecom/Datacom
Industry Control System
Distributed Power Architectures
Semiconductor Equipment
Microprocessor Power Applications
•
OUTPUT CURRENT UP TO 6A
•
SMALL SIZE AND LOW PROFILE :
0.80”
X
0.45”
X
0.22” (SMD) ; 0.9”
X
0.40”
X
0.20” (SIP)
•
HIGH EFFICIENCY - 94% @ 3.3V FULL LOAD
•
INPUT RANGE FROM 2.4VDC TO 5.5VDC
•
FIXED SWITCHING FREQUENCY (300KHZ)
•
SMD & SIP PACKAGES
•
OUTPUT VOLTAGE PROGRAMMABLE FROM 0.75VDC TO 3.3VDC
VIA EXTERNAL RESISTOR
•
INPUT UNDER-VOLTAGE LOCKOUT
•
UL60950-1, EN60950-1 AND IEC60950-1 LICENSED
•
ISO9001 CERTIFIED MANUFACTURING FACILITIES
•
COMPLIANT TO RoHS EU DIRECTIVE 2002/95/EC
OPTIONS
Positive Logic Remote on/off
DESCRIPTION
DOS06-05T (SMD type), DOH06-05T (for Vertical Mounting SIP type) and
DOH06-05TA (for Horizontal Mounting SIP type) are non-isolated DC/DC
converters that can deliver up to 6A of output current with full load efficiency of 94%
at 3.3V output.
T E C H N I C A L S P E C I F I C AT I O N
OUTPUT SPECIFICATIONS
Output current
Voltage accuracy
Minimum load
Line regulation
Load regulation
Vin=Vo(set)+0.5V to Vin(max.)
at Full Load
No Load to Full Load
Full load and Vin(nom.)
All specifications are typical at nominal input, full load and 25ºC otherwise noted
INPUT SPECIFICATIONS
6A max. Input voltage range
± 2%Vo(set) Maximum input current
0%
Input filter (Note 5)
Vo(set) < Vin – 0.5V
2.4 – 5.5VDC
6A
C filter
Vin=Vin(min.); Vo(set)=3.3V; Io=Io(max.)
Ripple and noise (Note2) 20MHz bandwidth
Temperature coefficient
ΔIo
/Δt = 2.5A/μS ,Vin(nom.)
Load change step
(50% to 100% or
100% to 50% of Io(max.))
ΔIo
/Δt = 2.5A/μS ,Vin(nom)
Dynamic load
Load change step
response
(50% to 100% or
(Note3)
100% to 50% of Io(max.))
Output current limit
Dynamic load
response
(Note2)
± 0.3%Vo(set),typ. Input no load current
Vo(set) =0.75Vdc
20mA,typ.
45mA,typ.
(Vin=5V, Io=0, module enabled)
Vo(set) =3.3Vdc
± 0.4%Vo(set),typ.
Start-up voltage
2.2V,typ.
20mVrms,max. Input under voltage lockout
2.0V,typ.
Shutdown voltage
50mVp-p,max.
Input reflected ripple current 5~20MHz, 1μH source impedance 35mAp-p
±0.4%,
typ.
Peak deviation 130mV,typ.
ENVIRONMENTAL SPECIFICATIONS
Setting time
Operating ambient temperature
–40ºC ~ +85ºC(with derating)
(Vo<10%peak
25μS,typ.
deviation)
Storage temperature range
–55ºC ~ +125ºC
Peak deviation 50mV,typ.
Thermal shock
MIL-STD-810F
Setting time
(Vo<10%peak
50μS,typ. Over temperature protection
135 ºC, typ.
deviation)
220%,typ.
FEATURE SPECIFICATIONS
Output short-circuit current
Hiccup, automatics recovery Remote ON/OFF(Note 6)
ON = 0V < Vr < 0.3V
I
IN
=10μA, max.
(Negative logic)(standard)
ESR≧1mΩ
1000μF,max.
External load capacitance
OFF
=
1.5V < Vr < Vin(max)
I
IN
=1mA, max.
3000μF,max.
ESR≧10mΩ
(Positive logic)(option)
ON = Vin(max)
I
IN
=10μA, max.
Output voltage overshoot-startup Vin=2.4~5.5V, F.L.
1%Vo(set)
OFF=0V < Vr < 0.3V
I
IN
=1mA, max.
Voltage adjustability (see fig.1) (Note 4)
0.7525V ~ 3.63V Input current of Remote control pin
10μA~1.0mA
Remote off state input current Nominal Vin
0.6mA,typ.
GENERAL SPECIFICATIONS
Efficiency
Isolation voltage
Switching frequency
Approvals and standard
Dimensions
Weight
MTBF (Note 1)
See table Rise time
Time for Vo to rise from 10% to 90%of Vo(set)
Case 1 (Note 7)
Case 2 (Note 8)
6ms,max.
1ms, typ.
1ms, typ.
None Turn-on delay time
300KHz, typ.
IEC60950-1, UL60950-1, EN60950-1
SMD
0.80 X 0.45 X 0.22 Inch
(20.3 X 11.4 X 5.5 mm)
SIP
0.90 X 0.40 X 0.20 Inch
(22.9 X 10.2 X 5.0 mm)
2.8g(0.1oz)
7
BELLCORE TR-NWT-000332
2.133 x 10 hrs
6
3.247 x 10 hrs
MIL-HDBK-217F
RSG [ RSG ELECTRONIC COMPONENTS GMBH ]
