Lead Solder
Classification Reflow Profile (JEDEC J-STD-020C)
Lead-Free Solder
Classification Reflow Profile (JEDEC J-STD-020C)
Recommended Soldering Pattern
Note:
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•
•
•
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Electrical isolation is required between Slug
and solder Pad.
For optimal thermal performance, macimize
board metalization at heat slug contact.
Reflow soldering should not be done more
than one time.
When soldering, do not put stress on the
emitters during heating.
After soldering, do not warp the circuit board
3. Static Electricity
•
The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
4. Heat Generation
•
The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
07.04.2011
VL400-EMITTER
4 of 4
ROITHNER [ Roithner LaserTechnik GmbH ]
