6 Supplements
6.1 ODS materials
This product shall not contain the following materials. Also the following materials shall not be used in
the production process for this product.
Materials for ODS:CFCs、Halon，Carbon tetrachloride ,etc.
6.2 Brominated flame retardants
6.3 Packing
6.3.1 Packing method
（1）
Laser diodes are packaged in an Anti-Static-plastic box.
（2）
Each Anti-Static-plastic box can accommodate 100 laser diodes maximum.
（3）
5 Anti-Static-plastic box is piled up together and enlaced with an Elastic band.
（4）
The above bound boxes are stuffed into a clean Anti-Static-bag ,then this is vacuumized and
sealed thermally.
（5）
Each packing case can accommodate 500 laser diodes, which is the minimum unit of packing.
labels where the model number, quantity and lot number are printed are struck on both of the
bag and on the case（refer to 6.3.4）.
6.3.2 Packing materials
No.
1
2
3
6.3.3 Case appearance
Component parts
Laser tray
Package bag
Package box
Material
Conductive polystyrene resin
Anti-static plastic
cardboard
03.08.2010
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ROITHNER [ Roithner LaserTechnik GmbH ]
