Device Numberʚ
ECNʚ
23-21UBGC/TR8
MODEL NO:
DSE-231-009 REV. 1.0
Reverse Package Chip LED
Page: 7/8
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ˮ Soldering heat reliability ( DIP ) :
Please refer to the following figure :
ˮ Soldering Iron :
Basic spec is ̉5 sec when 260̺.If temperature is higher, time should be shorter (+10̺
̨ -1sec). Power dissipation of iron should be smaller than 15 W , and temperature should
be controllable. Surface temperature of the device should be under 230 ̺.
ˮ Rework :
1. Customer must finish rework within 5 sec under 260̺.
2. The head of iron can not touch copper foil.
3. Twin-head type is preferred.
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ROITHNER [ Roithner LaserTechnik GmbH ]
