Reliability Test Result
6
RR-SML-1710
LED
Product
Package
Series
SMD
SML-D14xW_C_series
1.Test Result
n
(pcs)
Pn
(pcs)
Reference
STD
J-STD-020D-01
Test Items
Test Condition
Solder Heat Resistance
for Reflow Soldering
Prtreatment : Temperature Humidity Strage
(30℃/70%RH/168hr)
Reflow Peak Temp. : 260℃ 10sec Over 230℃/60sec
Preheat : 140 to 180℃ 60sec
Number of reflow : 2 times
22
0
JESD22-B102E
Solderbility
Drop test
Immerse into rosin flux for 5±1sec,and the device
for 3±0.5sec into Pb-free solder bath at 245±5℃
22
22
22
22
22
22
22
22
0
0
0
0
0
0
0
0
*1
JEITA ED-4701
A-124
H=75cm Maple Boad : 3 times
JEITA ED-4701
A-121
Vibration
100～2000Hzꢀ98.1m/s2ꢀ
2hours each on each direction of X,Y,Z
JESD22-A104E Ta=Tstg Min.℃(30min.) ～ Tstg Max.℃(30min.) 1000cycleꢀ
Thermal Cycle
JESD22-A103E Ta=Tstg Max.+5℃/-0℃
High Temperature
Strage
1000hrs
240hrs
JEITA ED-4701
B-121
High Temperature
High Humidity Strage
Ta=85±2℃ꢀ85±5%RH
JESD22-A119A
Low Temperature
Strage
Ta=Tstg Min.±5℃ꢀ 1000hrs
Ta=25±5℃ꢀIF=IFMax. 1000hrs
JESD22-A108D
Load Life
2.Failure Criteria
Items
Condition
IF=20mA
Criteria
Luminous Intensity
60% of the initial value
Changing rate of ±10%
Forward Voltage
Reverse Current
Appearance
IF=20mA
VR=VR Max.
Visual Check
Maximum of specification
No major change in appearance
*1
Solderbility
More than 95% of the electrode must be covered with solder.
※This data is actual value from specific lot and is not guaranteed.
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2023.03-Rev.001
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