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R6018JNJ
Datasheet
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llThermal resistance
Values
Unit
Min. Typ. Max.
Parameter
Symbol
RthJC
RthJA
Tsold
Thermal resistance, junction - case
-
-
-
-
-
-
0.57 ℃/W
Thermal resistance, junction - ambient
Soldering temperature, wavesoldering for 10s
80
℃/W
265
℃
llElectrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
V(BR)DSS
IDSS
Conditions
Unit
V
Min. Typ. Max.
Drain - Source breakdown
voltage
V
V
= 0V, I = 1mA
D
600
-
-
-
-
GS
= 600V, V = 0V
DS
GS
Zero gate voltage
drain current
100
μA
T = 25°C
j
IGSS
V
V
V
= ±30V, V = 0V
DS
Gate - Source leakage current
Gate threshold voltage
-
-
±100
7.0
nA
V
GS
DS
GS
VGS(th)
= V , I = 4.2mA
5.0
6.0
GS
D
= 15V, I = 9.0A
D
Static drain - source
on - state resistance
*5
RDS(on)
-
-
0.220 0.286
1.7
Ω
Ω
T = 25°C
j
RG
Gate resistance
f = 1MHz, open drain
-
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© 2019 ROHMCo., Ltd. All rights reserved.
2/11
20190527 - Rev.002
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