LM393DT,LM393PT,LM393ST,LM393WDT,LM393WPT,
LM2903DT,LM2903PT,LM339DT,LM339PT,LM2901DT,LM2901PT
Technical Note
SIGNATURE SERIES LM2903/2901/393/339 family
●Derating Curve
800
1000
800
600
400
200
0
LM339PT
600
LM393PT
LM2903PT
LM2901PT
400
LM2903DT
LM2901DT
LM339DT
LM393DT
200
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
LM393DT/PT/WDT/WPT
LM2903DT/PT
LM339DT/PT
LM2901DT/P
Power Dissipation
Power Dissipation
Package
Pd[W]
450
θja [℃/W]
Package
Pd[W]
θja [℃/W]
3.6
4.0
SO package14
TSSOP14
610
870
4.9
7.0
SO package8 (*8)
TSSOP8 (*6)
500
θja = (Tj-Ta)/Pd[℃/W]
θja = (Tj-Ta)/Pd[℃/W]
Fig.91 Derating Curve
●Precautions
1) Unused circuits
Vcc+
When there are unused circuits it is recommended that they be connected as in Fig.92,
setting the non-inverting input terminal to a potential within the in-phase input voltage
range (VICM).
－
＋
2) Input terminal voltage
Applying Vcc- + 36[V] to the input terminal is possible without causing deterioration
of the electrical characteristics or destruction, irrespective of the supply voltage.
However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is within
the common mode input voltage range of the electric characteristics.
Vcc-
3) Power supply (single / dual)
Fig.92 Disable circuit example
The op-amp operates when the specified voltage supplied is between Vcc+
and Vcc-. Therefore, the single supply op-amp can be used as a dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in the electrical characteristics due to a rise in chip
temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual
operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power
supply, or the output and Vcc- may result in IC destruction.
6) Terminal short-circuits
When output and Vcc+ terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently,
destruction.
7) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
8) Radiation
This IC is not designed to withstand radiation.
9) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to
piezoelectric (piezo) effects.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is
recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF
before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during
transportation and storage.
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2011.06 - Rev.C
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