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BA10324AF-E2 参数 Datasheet PDF下载

BA10324AF-E2图片预览
型号: BA10324AF-E2
PDF下载: 下载PDF文件 查看货源
内容描述: 接地检测运算放大器 [Ground Sense Operational Amplifiers]
分类和应用: 运算放大器放大器电路光电二极管
文件页数/大小: 48 页 / 644 K
品牌: ROHM [ ROHM ]
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BA10358xx, BA10324Axx, BA2904xxx, BA2904Sxxx, BA2904Wxx  
BA2902xx, BA2902Sxx  
Datasheet  
VCC  
Operational Notes  
1) Unused circuits  
+
-
When there are unused op-amps, it is recommended that they are  
connected as in Figure 104, setting the non-inverting input terminal to a  
potential within the in-phase input voltage range (Vicm).  
Connect  
to Vicm  
Vicm  
2) Input voltage  
VEE  
Applying VEE +32V to the input terminal is possible without causing  
deterioration of the electrical characteristics or destruction, regardless of  
the supply voltage. However, this does not ensure normal circuit operation.  
Please note that the circuit operates normally only when the input voltage is  
within the common mode input voltage range of the electric characteristics.  
Figure 104. Example of  
application circuit for unused op-amp  
3) Power supply (single / dual)  
The op-amp operates when the voltage supplied is between VCC and VEE.  
Therefore, the single supply op-amp can be used as dual supply op-amp as  
well.  
4) Power dissipation Pd  
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including  
reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power  
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal  
derating curves for more information.  
5) Short-circuit between pins and erroneous mounting  
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation  
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.  
6) Operation in a strong electromagnetic field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
7) Radiation  
This IC is not designed to withstand radiation.  
8) IC handling  
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical  
characteristics due to piezo resistance effects.  
9) IC operation  
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected  
to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and  
charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias  
current for Class A operation will suppress crossover distortion.  
10) Board inspection  
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every  
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that  
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the  
assembly process as well as during transportation and storage.  
11) Output capacitor  
If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor will flow into the  
output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor  
smaller than 1uF between output and GND.  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0RAR1G200130-1-2  
11.Jan.2013 Rev.002  
40/45  
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