Datasheet
BAxxDD0xx BAxxCC0xx
●I/O equivalence circuit
<BAxxDD0xx Series>
<BAxxCC0xx Series>
Vcc
Vcc
10kΩ
Vcc
25kΩ
OUT
OUT
R2
R1
39kΩ 2kΩ
CTL
25kΩ
10kΩ
CTL
R2
R1
31kΩ
Fig.27
Fig.28
●Power Dissipation
TO220FP-5
HRP-5
25
20
15
10
5
10
Board size : 70×70×1.6 ㎜3 (board contains a thermal via)
Board front copper foil area : 10.5×10.5 ㎜2
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
9
8
7
6
5
4
3
2
1
0
①2-layer board (back surface copper foil area :15×15 ㎜2
②2-layer board (back surface copper foil area :70×70 ㎜2
③4-layer board (back surface copper foil area :70×70 ㎜2
)
)
)
(1)20.0
③7.3W
②5.5W
①2.3W
(2)2.0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambienttemperature:Ta(℃）
Ambient temperature:Ta(
℃）
Fig.30
Fig.29
TO252-5
2.0
1.6
1.2
0.8
0.4
0.0
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
1.30
0
25
50
75
100
125
150
Ambient temperature:Ta(
℃）
Fig.31
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TSZ02201-0R6R0A600130-1-2
25.July.2013 Rev.002
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13/20
TSZ22111･15･001
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