B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
1.778 BSC
7.62 BSC
5.08
0.56
1.17
H
C
K
0.300 BSC
0.008 0.015
0.20
2.92
0.38
3.43
–T–
K
L
0.115
0.135
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0
15
0
0.51
15
1.02
M
F
0.020 0.040
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
56
29
28
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
MAX
52.45
14.22
5.08
A
B
C
D
E
2.035
0.540
0.155
0.014
2.065 51.69
0.560 13.72
0.200
0.022
L
3.94
0.36
0.56
H
C
0.035 BSC
0.89 BSC
F
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
15
0
0.51
15
1.02
0.020
0.040
E
J 56 PL
D 56 PL
M
S
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
13–22
MOTOROLA ANALOG IC DEVICE DATA
ROCHESTER [ Rochester Electronics ]
