DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
–B–
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
9.40 10.16 0.370 0.400
INCHES
MIN MAX
F
A
B
C
D
F
–A–
NOTE 2
6.10
3.94
0.38
1.02
6.60 0.240 0.260
4.45 0.155 0.175
0.51 0.015 0.020
1.78 0.040 0.070
L
G
H
J
K
L
2.54 BSC
0.100 BSC
1.27 0.030 0.050
0.30 0.008 0.012
8
C
0.76
0.20
2.92
1
J
3.43
0.115
0.135
–T–
SEATING
PLANE
7.62 BSC
0.300 BSC
N
M
N
–––
10
–––
10
0.76
1.01 0.030 0.040
M
D
K
G
H
M
M
M
0.13 (0.005)
T A
B
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
14
1
8
B
7
INCHES
DIM MIN MAX
0.770 18.16
MILLIMETERS
A
F
MIN
MAX
19.56
6.60
4.69
0.53
1.78
A
B
C
D
F
0.715
0.240
0.145
0.015
0.040
0.260
0.185
0.021
0.070
6.10
3.69
0.38
1.02
L
14
1
C
G
H
J
K
L
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
M
N
0
10
0.039
0
0.39
10
1.01
0.015
H
G
D
M
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
C
L
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
16
1
SEATING
PLANE
–T–
G
H
J
K
L
M
S
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
13–5
MOTOROLA ANALOG IC DEVICE DATA