PACKAGE OPTION ADDENDUM
www.ti.com
28-Mar-2006
PACKAGING INFORMATION
Orderable Device
SN74LVC1G14DBVR
SN74LVC1G14DBVRE4
SN74LVC1G14DBVRG4
SN74LVC1G14DBVT
SN74LVC1G14DBVTE4
SN74LVC1G14DCKR
SN74LVC1G14DCKRE4
SN74LVC1G14DCKRG4
SN74LVC1G14DCKT
SN74LVC1G14DCKTE4
SN74LVC1G14DCKTG4
SN74LVC1G14DRLR
SN74LVC1G14DRLRG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
DRL
DRL
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOP
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOP
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC1G14YEAR
SN74LVC1G14YEPR
SN74LVC1G14YZAR
NRND
NRND
NRND
WCSP
WCSP
WCSP
YEA
YEP
YZA
5
5
5
3000
3000
3000
TBD
TBD
SNPB
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Pb-Free
(RoHS)
SNAGCU
SN74LVC1G14YZPR
SN74LVC1G14YZTR
SN74LVC1G14YZVR
ACTIVE
ACTIVE
ACTIVE
WCSP
DSBGA
DSBGA
YZP
YZT
YZV
5
4
4
3000
3000
3000
Pb-Free
(RoHS)
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Pb-Free
(RoHS)
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1