PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM124DR
LM224ADR
SOIC
SOIC
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2000
2000
2000
2000
2000
2000
2000
367.0
333.2
333.2
367.0
367.0
367.0
367.0
333.2
367.0
333.2
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
364.0
367.0
367.0
345.9
345.9
367.0
367.0
367.0
367.0
345.9
367.0
345.9
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
364.0
367.0
38.0
28.6
28.6
38.0
38.0
38.0
38.0
28.6
38.0
28.6
35.0
35.0
38.0
38.0
35.0
35.0
35.0
38.0
27.0
35.0
LM224ADRG4
LM224ADRG4
LM224DR
SOIC
D
SOIC
D
SOIC
D
LM224KADR
SOIC
D
LM224KDR
SOIC
D
LM2902DR
SOIC
D
LM2902DR
SOIC
D
LM2902DRG4
LM2902KAVQPWR
LM2902KAVQPWRG4
LM2902KDR
SOIC
D
TSSOP
TSSOP
SOIC
PW
PW
D
LM2902KNSR
LM2902KPWR
LM2902KVQPWR
LM2902KVQPWRG4
LM2902NSR
SO
NS
PW
PW
PW
NS
PW
PW
TSSOP
TSSOP
TSSOP
SO
LM2902PWR
LM2902PWR
TSSOP
TSSOP
Pack Materials-Page 3
ROCHESTER [ Rochester Electronics ]
